Beijing Goodwill Metal is a professional research and manufacture high-tech department of sputtering targets. We can provide sputtering targets with steady quality, diversified composition and specification serialization using hot isostatic pressing (HIP), cold isostatic pressing (CIP) ,hot processing (HP) and vacuum sintering processes. And we also offer combining targets and sputtering metal and bnding services according to customer require.
Gold Sputtering Target
Max size 1000×250mm, Special specification can be provided according to customer requirements
Au/Al, Au/As, Au/Ag, Au/Be, Au/Ge, Au/Pd, Au/Ni, Au/Sb, Au/Sn, Au/Zn, Au/Ge/Ni
Type of Bond
RIndium RElastomer RSilver Adhesive
Gold Sputtering Targets (Au Target)
Purity --- 99.99% Shape --- Discs, Plate, Step (Dia ≤500mm,, Thickness ≥1mm)
Rectangle, Sheet, Step (Length ≤1000mm, Width ≤500mm, Thickness ≥1mm)
Seamless Tube( Diameter< 300mm, Thickness >3mm ), Seamless Cirque ( Diameter< 300, Thickness >3mm)
Gold (Au) Evaporation Material
Density--- 19.32 g/cm3
Dimension---wire(Dia0.1-2mm), powder(200mesh), piece(0.1-3mm),Taper, customed
Applications---decorate film, and others
Gold Metal Product (Au Wire, Rod, Foil, Slab, Disk, Tube )
Purity --- 99.99%
Speciafication --- Wire (diameter 0.002mm - 1mm), Rod (diameter 1mm - 100mm ),Foil (thickness to 0.05mm - 0.1mm, width < 300mm) Slab (thickness 0.1mm- 20mm, width < 400mm), Disc (diameter < 350mm, thickness 0.1mm - 30mm )
Tube (OD: 0.5-300mm, Thickness: 0.05-5.0mm)
R Semiconductor&Electronic industry
• For the post-segment manufacturing process with the purpose of encapsulation, Chip Scale Packaging (CSP) technology was adopted for large Scale, mainly using Al, Cu, Cr, Ti, NiV. The material requirements of the target material were lower than those of the previous segment manufacturing process
• LCD drive IC - based Encapsulation Process, mainly using Au & WTi.
In order to avoid brittle Metal, alloy, such as easy to crack oxide materials in use process, Goodwill Metal can provide bonding for customer service, the bonding target material on the copper back, in addition to the protection of target material from shipping or take up unexpectedly, also can ensure good cooling and electrical contact of target material, and can improve the use of target when the problem of insufficient mechanical strength or solve the problem of large size area of target material limited.Generally, the back plates used for bonding target material are copper, titanium, molybdenum and stainless steel.
The back plate supports the target material during sputtering so as to prevent the cracking of target material during sputtering and improve the usage rate and service life of target material.
Bonding scope: metal target, ceramic target, alloy target, rotating target, plane target, circular target and shaped target.
“Customers first, quality first” is our tenet. Obeying quality policy “providing high quality and competitive products to satisfy user requirement”, the quality of products are consummated and transcended constantly. Technology and credit oriented.