hafnium nitride HfN Sputtering Target HfN Sputtering Target

hafnium nitride HfN Sputtering Target HfN Sputtering Target

Goodwill Metal Tech manufactures hafnium nitride HfN Sputtering Target. Our product is consistently good in quality and purity. We also makes doped targets by customer request.

Product Details


Specification

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Property: grey powder, cubic crystal structure. Melting point 3310 ℃, microhardness 16 gpa. 

Relatively stable, but easy to be wang shui, concentrated sulfuric acid, hydrofluoric acid corrosion. 

Reaction generated directly by the hafnium and nitrogen at 900 ℃, or by the hafnium halide and ammonia nitrogen and hydrogen making mixed gas reaction.

 Is an important component of hafnium alloy, an important refractory compound.


Product name

hafnium nitride target

Symbol

HfN

Manfucture method

Smelting

Size

Max size 2000L×250W, Max Diameter 400mm .Special specification can be provided according to customer requirements

Densi

 13.8g/cm3

Purity

99.9% , 99.99% ,99.999%

Melting point

3305°C

Grain size

<100um

Type of Bonding

RIndium         RElastomer        RSilver Adhesive    RAgCu



Application

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RArchitectural automotive glass

RSolar PV & Solar heating & Solar Cell 

RDecoration and Tool & Die

RResistive element 

RFLat Panel Display and Touch panel industry 

R Solid Electrolyte Fuel Cell (SOFC) 

Rsemiconductor&Electronic industry


Bonding service

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In order to avoid brittle Metal, alloy, such as easy to crack oxide materials in use process, Goodwill Metal can provide bonding for customer service, the bonding target material on the copper back, in addition to the protection of target material from shipping or take up unexpectedly, also can ensure good cooling and electrical contact of target material, and can improve the use of target when the problem of insufficient mechanical strength or solve the problem of large size area of target material limited.Generally, the back plates used for bonding target material are copper, titanium, molybdenum and stainless steel. The back plate supports the target material during sputtering so as to prevent the cracking of target material during sputtering and improve the usage rate and service life of target material.


At present, Goodwill Metal can provide pure indium, InSn, AgCu, Elastomer,high-temperature conductive adhesive series welding services, bonding rate of > 97%, reaching the international leading level.

Bonding scope: metal target, ceramic target, alloy target, rotating target, plane target, circular target and shaped target.

Detection method: ultrasonic detection c-scan.

绑定 03_副本



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