Sputtering is one of the main techniques for preparing thin-film materials. It uses ions generated by an ion source to accumulate in a vacuum to form a high-speed ion beam, bombarding a solid surface, and allowing ions and solid surface atoms to undergo kinetic energy exchange. The atoms on the solid surface are removed from the solid and deposited on the surface of the substrate. The bombarded solid is a raw material for depositing a thin film by sputtering, which is called a sputtering target. Various types of sputtered thin film materials have been widely used in semiconductor integrated circuits, recording media, flat display, and surface coating of workpieces.