Type of Bond
Indium Elastomer Silver Adhesive
1. Quality Control Document
ISO9001 ISO14001 MSDS
2. Certificate of Analysis
XRD XRF ICP GDMS SME C-Scan
Packaging & Shipping
Wooden Case Packing
Standard Export Packing
|Primarily used in the manufacture of compound semiconductor, high purity alloy, ultra-low temperature refrigeration alloy, superconducting material, ITO (Indium Tin Oxide), solder and as a dopant of compound semiconductor etc.|
1.Fastest feedback to your inquiry, provide professional advice on products.
2.Sample or trial order is acceptable before bulk ordering.
3.Provide Good quality products with competitive price.
4.Delivery on time.
5.Warm and considerable after-sale service.