Gold Sputtering Target

Goodwill Metal Tech manufactures Gold Sputtering Target Au. Our product is consistently good in quality and purity. We also makes doped targets by customer request.

Product Details

Beijing Goodwill Metal is a professional research and manufacture high-tech department of sputtering targets. We can provide sputtering targets with steady quality, diversified composition and specification serialization using hot isostatic pressing (HIP), cold isostatic pressing (CIP) ,hot processing (HP) and vacuum sintering processes. And we also offer combining targets and sputtering metal and bnding services according to customer require.


Specification image.png


Product name

Gold Sputtering Target

Symbol

Au 

Manfucture method

Smelting

Size

Max size 1000×250mm, Special specification can be provided according to customer requirements

Density

>99% 

Purity

99.99%-99.999%

Typical product

 Au/Al, Au/As, Au/Ag, Au/Be, Au/Ge, Au/Pd, Au/Ni, Au/Sb, Au/Sn, Au/Zn, Au/Ge/Ni

Grain size

<100um

Type of Bond

RIndium         RElastomer        RSilver Adhesive

Gold  Sputtering Targets (Au Target) 

Purity --- 99.99% Shape --- Discs, Plate, Step (Dia ≤500mm,,  Thickness ≥1mm)

                 Rectangle, Sheet,  Step (Length ≤1000mm, Width ≤500mm, Thickness ≥1mm)

                 Seamless Tube( Diameter< 300mm,  Thickness >3mm ), Seamless Cirque ( Diameter< 300, Thickness >3mm)

                                                                                                                                                                                              

Gold  (Au) Evaporation Material

Purity---  99.99%

Density--- 19.32 g/cm3

Dimension---wire(Dia0.1-2mm), powder(200mesh), piece(0.1-3mm),Taper, customed
Applications---decorate film, and others

                                                                                                                                                               

Gold Metal Product (Au Wire, Rod, Foil, Slab, Disk, Tube )

Purity --- 99.99%

Speciafication --- Wire (diameter 0.002mm - 1mm), Rod (diameter 1mm - 100mm ),Foil (thickness to 0.05mm - 0.1mm, width < 300mm)                              Slab (thickness 0.1mm- 20mm, width < 400mm), Disc (diameter < 350mm, thickness  0.1mm - 30mm )

                             Tube (OD: 0.5-300mm, Thickness: 0.05-5.0mm)

                                                                                         


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Application

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R Semiconductor&Electronic industry

• For the post-segment manufacturing process with the purpose of encapsulation, Chip Scale Packaging (CSP) technology was adopted for large Scale, mainly using Al, Cu, Cr, Ti, NiV. The material requirements of the target material were lower than those of the previous segment manufacturing process

• LCD drive IC - based Encapsulation Process, mainly using Au & WTi.


Bonding service

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In order to avoid brittle Metal, alloy, such as easy to crack oxide materials in use process, Goodwill Metal can provide bonding for customer service, the bonding target material on the copper back, in addition to the protection of target material from shipping or take up unexpectedly, also can ensure good cooling and electrical contact of target material, and can improve the use of target when the problem of insufficient mechanical strength or solve the problem of large size area of target material limited.Generally, the back plates used for bonding target material are copper, titanium, molybdenum and stainless steel. The back plate supports the target material during sputtering so as to prevent the cracking of target material during sputtering and improve the usage rate and service life of target material.

Bonding scope: metal target, ceramic target, alloy target, rotating target, plane target, circular target and shaped target.


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Our Servicesimage.png

“Customers first, quality first” is our tenet. Obeying quality policy “providing high quality and competitive products to satisfy user requirement”, the quality of products are consummated and transcended constantly. Technology and credit oriented.

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