Type of Bond
Indium Elastomer Silver Adhesive
1. Quality Control Document
ISO9001 ISO14001 MSDS
2. Certificate of Analysis
XRD XRF ICP GDMS SME C-Scan
Packaging & Shipping
Wooden Case Packing
Standard Export Packing
|Molybdenum disilicide is used in microelectronics as a contact material. It is often used as a shunt over polysilicon lines to increase their conductivity and increase signal speed.|
1.Fastest feedback to your inquiry, provide professional advice on products.
2.Sample or trial order is acceptable before bulk ordering.
3.Provide Good quality products with competitive price.
4.Delivery on time.
5.Warm and considerable after-sale service.