Aluminum scandium alloy sputtering target
AlSc alloy sputtering target
Max size 2000L×250W, Max Diameter 400mm .Special specification can be provided according to customer requirements
99.9% , 99.99%
AlSc30% ,AlSc15%, AlSc8%
Type of Bonding
RIndium RElastomer RSilver Adhesive RAgCu
Certificate Of Analysis
RElectrommunication&Aeronautics and Astronautics
Scandium aluminum alloy is a kind of high performance aluminum alloy, the aluminum alloy to add trace scandium, can promote grain refining, improve the recrystallization temperature of 250 ℃ ~ 280 ℃, is a strong grain refinement of aluminium alloy agent and a potent recrystallization inhibitors, obvious influence on the structure and properties of alloy, its strength, hardness, weldability and corrosion resistance is greatly improved.Scandium has a good dispersion strengthening effect on aluminum, and it maintains stable non-recrystallization structure in the state of hot processing or annealing. Some alloys are cold-rolled thin plates with large deformation, and they maintain this structure even after annealing.The inhibiting effect of scandium on recrystallization can eliminate the recrystallization structure in the heat affected zone of weld. The subcrystalline structure of matrix can be directly transferred to the as-cast structure of weld.The effect of scandium on the corrosion resistance of aluminum alloy is also due to the fact that scandium refines grain and inhibits recrystallization.Adding scandium also can make the aluminum alloy have good superplasticity, adding 0.5% or so of scandium aluminum alloy after superplasticity treatment, its elongation rate can reach 1100%.Therefore, al-scandium alloy is expected to become a new generation of light-weight structural materials for aerospace, aviation and shipbuilding industries. It is mainly used for welding load structural parts of aerospace, aviation and ships, as well as aluminum alloy pipes, railway oil tanks and key structural parts for high-speed trains in alkaline corrosive medium environment
AlSc30% is mainly used for 5G mobile communication.
1. Fully operate the computer information management system
The product status and production process can be checked at any time. The material coding, material shape, material location, equipment, operators, processing time and steps can be found through Lot No.
2. The operating procedures meet the requirements of ISO9001 quality system
The company implements scientific and strict management system, production process and operation procedure, and is strictly guaranteed from each link of product research and development, production and sales, and service.
3. All employees receive professional skills training and professional quality.
The company conducts regular assessment of employees' professional skills.
Our company has advanced laser particle size analyzer, powder specific surface area analyzer, metallographic microscope, scanning electron microscope, projection electron microscope, X-ray diffraction (XRD) and other professional material testing equipment, which can analyze powder particle size, particle size distribution, material metallographic structure, scanning structure, and phase structure.
ICP-AES (inductively coupled plasma emission spectrometer) is used for the analysis of trace elements. The elements that can be analyzed are most metals and a few non-metals such as silicon, phosphorus and sulfur.It has fast analysis speed, wide test range, small collective effect, small analysis dynamic range, and can quickly and accurately test impurities and analyze the purity of materials.
PDS ultrasonic inspection (C-SCAN) is used for the analysis of impurities, pores, cracks and other defects in metal and non-metal materials as well as the detection of product welding bonding rate. It has the advantages of high sensitivity, convenient operation, no damage and high precision.
In order to avoid brittle Metal, alloy, such as easy to crack oxide materials in use process, Goodwill Metal can provide bonding for customer service, the bonding target material on the copper back, in addition to the protection of target material from shipping or take up unexpectedly, also can ensure good cooling and electrical contact of target material, and can improve the use of target when the problem of insufficient mechanical strength or solve the problem of large size area of target material limited.Generally, the back plates used for bonding target material are copper, titanium, molybdenum and stainless steel. The back plate supports the target material during sputtering so as to prevent the cracking of target material during sputtering and improve the usage rate and service life of target material.
At present, Goodwill Metal can provide pure indium, InSn, AgCu, Elastomer,high-temperature conductive adhesive series welding services, bonding rate of > 97%, reaching the international leading level.
Bonding scope: metal target, ceramic target, alloy target, rotating target, plane target, circular target and shaped target.
Detection method: ultrasonic detection c-scan.
Package & Delivery
Standard carton box ,Vacuum Packing, Wooden Case Packing
Within 2-3 working days
Door to door(DHL/TNT/UPS/FEDEX/EMS…), By air, By sea
As a professional manufacturer, we provide follow services:
1.Fastest feedback to your inquiry, provide professional advice on products.
2.Sample or trial order is acceptable before bulk ordering.
3.Provide Good quality products with competitive price.
4.Delivery on time.
5.Warm and considerable after-sale service.