The requirements for sputtering targets are higher than those of traditional materials industries. General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size and defect control; higher requirements or special Requirements include: surface roughness, resistance, grain size uniformity, composition and organization uniformity, foreign matter (oxide) content and size, magnetic permeability, ultra-high density and ultra-fine grain and so on. Magnetron sputtering coating is a new type of physical vapor deposition method, which is to use electron gun system to emit electrons and focus on the material to be plated, so that the sputtered atoms follow the principles of momentum conversion with high kinetic energy to separate materials. Fly to the substrate deposition film. The plated material is called a sputtering target. Sputter targets include metals, alloys, ceramics, borides, and the like.